Immersion Tin (IAg) is applied directly to the base metal of a PCB via chemical displacement. It’s a more affordable option than ENIG, and it is also RoHS-compliant. A typical thickness for Immersion Silver is 4-12u”.
Immersion Silver
Immersion Tin (IAg) is applied directly to the base metal of a PCB via chemical displacement. It’s a more affordable option than ENIG, and it is also RoHS-compliant. A typical thickness for Immersion Silver is 4-12u”.
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