Capabilities
Texas Circuitry
Texas Circuitry manufacturing team has experience with a large number of board types and technologies, as well as standard single sided through multilayer product. Whenever you have a special requirement or need a unusual board type, give us a call, we pride ourselves on our customer support.
Texas Circuitry Team Has Experience.
With a large number of board types and technologies, as well as standard single sided through multilayer product. Whenever you have a special requirement or need a unusual board type, give us a call, we pride ourselves on our customer support.
Special Capabilities
- Fine lines and SMT pitch
- Board thickness 0.008 to 0.250
- Carbon Ink Contacts
- Oversized multilayer boards
- Ball Grid Array (BGA) patterns
- Blind and buried vias
- Peelable/Water soluble masks
- Plated slots and edges
- Epoxy via plug
- Blind Buried Vias
- Control Impedance
Testing
- Precision Gold and Copper thickness measurement
- Multifunctional Epoxy
- Complete micro section system
- Ionic Contamination
- 100% Node and Netlist Testing
- Clam Shell electrical testing
- Flying grid electrical testing
- SMT fixtures build in-house
- Certified test results
- Statistical Process Control (SPC)
- AOI system for inner and outerlayers
Board Types
- CEM 1 and CEM3
- Polyimide
- Cyanate Ester
- Multifunctional Epoxy
- PTFE (Teflon)
- Flex, Getek and Rigid-Flex
- High Temperature FR-4, FR-406, FR-408 & FR-5
- Low Dk, Low Df, High Tg
- Aluminium clad
- Rogers 3010, 4000, 5880, 6200
- Halogen Free boards
Processing
- Largest panel size -18 x 30
- Maximum number of layers -14
- Minimum circuit width -.005
- Smallest finished hole -.008
- Maximum finished copper -7 oz
- PTH tolerance -+/- .003
- Routed feature tolerance -+/- .005
- Solder mask opening allowance
- Wet mask -.010 per side
- LPI – .0025 per side
- Annular ring PTH hole +/- .005
Surface Finishes
- HASL (Hot Air Leveled Solder)
- Lead Free Solder
- ENIG (Electroless Nickel Immersion Gold)
- Hard Gold
- Immersion Silver
- Immersion nickel
- Solder Mask Over Bare Copper (SMOBC)
- White Tin (Immersion Tin)
- Selective Hard Gold
- OSP (Organic Solderability Preservatives)
Engineering Services
- Integrated CAM and photo plotting
- Array Design/Panelization
- Design For Manufacturability (DFM)