by Admin | Jul 9, 2018 | Uncategorized
Immersion Tin (IAg) is applied directly to the base metal of a PCB via chemical displacement. It’s a more affordable option than ENIG, and it is also RoHS-compliant. A typical thickness for Immersion Silver is 4-12u”.
by Admin | Jun 6, 2018 | Uncategorized
VIPPO is rapidly becoming more commonly used in modern printed circuit design due to the ever decreasing pitch of component footprints, along with the need to miniaturize PCB form factor.
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