Advanced PCB Manufacturing
Precision PCB Manufacturing Capabilities for Complex Electronics
Texas Circuitry delivers high-reliability printed circuit board manufacturing for industries requiring precision, performance, and consistency. From prototype development to full-scale production, our engineering team supports complex multilayer designs, advanced materials, and demanding electronic applications.
Quick Manufacturing Specs
Layer Capability
Up to 14 Layers
Trace / Space
5 / 5 mil
Copper Weight
Up to 7 oz
Surface Finishes
ENIG • Lead Free HASL • HASL • OSP Immersion Tin • Immersion Silver Immersion Nickel • Hard Gold
📊 Core capabilities
| Layer Count | Up to 14 Layers |
| Copper Thickness | Up to 7 oz Finished Copper |
| Minimum Trace / Space | 0.005" |
| Smallest Finished Hole | 0.008" |
| Board Thickness | 0.008" to 0.250" |
| Maximum Panel Size | 18 x 30 inches |
| Lead Time | Standard and 24 Hour Quick Turn |
Special Capabilities
- ▹ Fine lines and SMT pitch
- ▹ Board thickness 0.008 to 0.250
- ▹ Carbon Ink Contacts
- ▹ Oversized multilayer boards
- ▹ Ball Grid Array (BGA) patterns
- ▹ Blind and buried vias
- ▹ Peelable / Water soluble masks
- ▹ Plated slots and edges
- ▹ Epoxy via plug
- ▹ Blind Buried Vias
- ▹ Control Impedance
Supported Board Types
• CEM 1 and CEM3
• Polyimide
• Cyanate Ester
• Multifunctional Epoxy
• PTFE (Teflon)
• Flex, Getek and Rigid-Flex
• High Temp FR-4, FR-406, FR-408 & FR-5
• Low Dk, Low Df, High Tg
• Aluminium clad
• Rogers 3010, 4000, 5880, 6200
• Halogen Free boards
🔧 Processing specifications
| Largest panel size | 18 x 30 inches |
| Maximum layers | 14 |
| Minimum circuit width | .005" |
| Smallest finished hole | .008" |
| Maximum finished copper | 7 oz |
| PTH tolerance | +/- .003" |
| Routed feature tolerance | +/- .005" |
| Solder mask opening allowance | — |
| Wet mask | .010" per side |
| LPI | .0025" per side |
| Annular ring PTH hole | +/- .005" |
Available Surface Finishes
• HASL (Hot Air Leveled Solder)
• Lead Free Solder
• ENIG (Electroless Nickel Immersion Gold)
• Hard Gold
• Immersion Silver
• Immersion Nickel
• Solder Mask Over Bare Copper (SMOBC)
• Immersion Tin (White Tin)
• Selective Hard Gold
• OSP (Organic Solderability Preservatives)
Testing & Quality Control
• Precision gold/copper thickness
• Complete micro section system
• Ionic contamination testing
• 100% node and netlist testing
• Clam shell electrical testing
• Flying grid electrical testing
• SMT fixture builds in-house
• Certified test results
• Statistical Process Control (SPC)
• AOI system inner/outer layers
Engineering & CAM Support
- ◉ Integrated CAM and photoplotting
- ◉ Array design / panelization
- ◉ Design for manufacturability (DFM)
📥 complete guide
Download capabilities PDF
Full technical specifications, stackups, and material data.
Download Capabilities PDF ⬇️